RF800 is a professional soldering flux designed for precise soldering of SMD and SMT components. Thanks to its excellent wetting properties, it ensures high-quality and reliable solder joints on copper (Cu) as well as tin-lead (PbSn) surfaces.

The flux is developed on the basis of a moderately active rosin solution and uses No Clean technology, so after soldering is completed it is not necessary to remove flux residues. This significantly makes work easier during electronics repairs and speeds up the service process.

RF800 is suitable for professional servicing of mobile phones, laptops, motherboards and common electronics. Thanks to the practical bottle with applicator, it allows precise dosing even when working with fine components and hard-to-reach areas.

The flux meets the J-STD-004 ROL0 standard, confirming its high quality and safety for use in the electronics industry.

Key benefits

• professional flux for SMD and SMT soldering
• excellent wetting of Cu and PbSn surfaces
• No Clean technology with no need for cleaning
• precise application for fine repairs
• suitable for electronics servicing and PCBs
• high-quality and reliable solder joints
• professional standard J-STD-004 ROL0

Suitable use

• soldering SMD components
• mobile phone repairs
• servicing laptops and motherboards
• SMT assembly and rework
• tinning wires
• soldering PCBs and fine electronics

Specifications

• Type: RF800 / No Clean flux
• Volume: 15 ml
• Application: bottle with applicator
• Standard: J-STD-004 ROL0
• Intended for: SMD / SMT soldering
• Suitable surfaces: Cu, PbSn