AG RMA Flux Gel is a professional soldering flux designed for assembly, repairs and rework of SMD/SMT electronics. Thanks to its thickened gel consistency, it allows precise application even when working with fine components and BGA chips.

The flux is developed on the basis of rosin RMA-class flux and provides excellent solderability on surfaces of silver, copper, gold, zinc, cadmium, as well as tin-lead alloys. The special formula supports fast and clean solder joining and minimises oxidation during soldering.

The product uses “No Clean” technology, so after use it is not necessary to remove flux residues, which greatly simplifies work in electronics servicing and motherboard repairs.

The flux meets international standards ISO 9454-1 and J-STD-004 ROM0, confirming its high quality, safety and reliability for professional use.

Key benefits

• gel flux for SMD and SMT soldering
• precise and convenient application
• No Clean technology with no need for cleaning
• excellent solderability and wetting
• suitable for repairs of mobile phones, laptops and PCBs
• minimises oxidation during soldering
• professional quality for service and workshop use

Suitable applications

• soldering SMD components
• SMT assembly and repairs
• motherboard rework
• repairs of mobile phones and laptops
• work with PCBs and fine electronics
• BGA and micro soldering

Specifications

• Type: RMA Flux / gel flux
• Technology: No Clean
• Volume: 10 ml
• Consistency: thickened gel
• Colour: amber
• Standard: ISO 9454-1, J-STD-004 ROM0
• Suitable for: Ag, Cu, Au, Zn, Cd, SnPb